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KLM4G1FEPD-B031 - SAMSUNG

Description: NAND Flash, Blank, 1.70 V, 4 G, NA, W EMMC

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Symbol

KLM4G1FEPD-B031 - SAMSUNG - PCB symbol

PCB Footprints

KLM4G1FEPD-B031 - SAMSUNG PCB footprint - BGA - BGA - 153 BALL BGA

3D Models

KLM4G1FEPD-B031 - SAMSUNG - 3D model - BGA - 153 BALL BGA

Datasheet Download Datasheet
Stock & Prices Price & Stock for KLM4G1FEPD-B031
Part Number KLM4G1FEPD-B031
Manufacturer SAMSUNG
Pin Count 153
Part Category Integrated Circuit
Package Category BGA
Footprint Name BGA - 153 BALL BGA
Released Date Apr 6, 2022
Last Modified Date Mar 7, 2023 4:10 PM UTC
Pinout / Pin List Click Here (Member Only)

KLM4G1FEPD-B031 Details

Manufacturer Part Number:
KLM4G1FEPD-B031
Manufacturer:
Samsung Electro-Mechanics

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