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KLM4G1FETE-B041001 - SAMSUNG

Description: Mainstream, eMMC v5.0 Flash

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Symbol

KLM4G1FETE-B041001 - SAMSUNG - PCB symbol

PCB Footprints

KLM4G1FETE-B041001 - SAMSUNG PCB footprint - BGA - BGA - 153FBGA(H=0.8mm)

3D Models

KLM4G1FETE-B041001 - SAMSUNG - 3D model - BGA - 153FBGA(H=0.8mm)

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Part Number KLM4G1FETE-B041001
Manufacturer SAMSUNG
Pin Count 153
Part Category Integrated Circuit
Package Category BGA
Footprint Name BGA - 153FBGA(H=0.8mm)
Released Date Feb 18, 2023
Last Modified Date Mar 7, 2023 4:10 PM UTC
Pinout / Pin List Click Here (Member Only)

KLM4G1FETE-B041001 Details

Manufacturer Part Number:
KLM4G1FETE-B041001
Manufacturer:
Samsung Electro-Mechanics

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