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KLMBG2JETD-B041003 - SAMSUNG

Description:  embedded MultiMediaCard Ver. 5.1 compatible.  SAMSUNG eMMC supports features of eMMC5.1 which are defined in JEDEC Standard - Supported Features : Packed command, Cache, Discard, Sanitize, Power Off Notification, Data Tag, Partition types, Context ID, Real Time Clock, Dynamic Device Capacity, Command Queuing, Enhanced Strobe Mode, Secure Write Protection, HS200, HS400, Field Firmware Update. - Non-supported Features : Large Sector Size (4KB)  Full backward compatibility with previous Multi

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KLMBG2JETD-B041003 - SAMSUNG - PCB symbol

PCB Footprints

KLMBG2JETD-B041003 - SAMSUNG PCB footprint - BGA - BGA - 11.5mm x 13mm x 0.8mm_

3D Models

KLMBG2JETD-B041003 - SAMSUNG - 3D model - BGA - 11.5mm x 13mm x 0.8mm_

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Part Number KLMBG2JETD-B041003
Manufacturer SAMSUNG
Pin Count 153
Part Category Integrated Circuit
Package Category BGA
Footprint Name BGA - 11.5mm x 13mm x 0.8mm_
Released Date Aug 23, 2024
Last Modified Date Aug 23, 2024 5:08 AM UTC
Pinout / Pin List Click Here (Member Only)

KLMBG2JETD-B041003 Details

Manufacturer Part Number:
KLMBG2JETD-B041003
Manufacturer:
Samsung Electro-Mechanics

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