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KLMBG4GEND-B031 - SAMSUNG

Description: Samsung e·MMC 5.0, 64Gb MLC x 4, 153FBGA

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PCB Footprints
KLMBG4GEND-B031 - SAMSUNG PCB footprint - BGA - BGA - 11.5mm x 13mm x 1.0mm Package Dimension
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3D Models
KLMBG4GEND-B031 - SAMSUNG  - 3D model - BGA - 11.5mm x 13mm x 1.0mm Package Dimension
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KLMBG4GEND-B031 Details

  • Manufacturer Part Number:

    KLMBG4GEND-B031

  • Manufacturer:

    Samsung Electro-Mechanics

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