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KSD1691GS - onsemi

Description: High Power Dissipation: PC= 1.3 W (Ta=25°C); Complementary to KSB1151; Low Collector-Emitter Saturation Voltage & Large Collector Current

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KSD1691GS - onsemi - PCB symbol
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PCB Footprints
KSD1691GS - onsemi PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-126_
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3D Models
KSD1691GS - onsemi - 3D model - Transistor Outline, Vertical - TO-126_
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KSD1691GS Details

  • Manufacturer Part Number:

    KSD1691GS

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-126-3

  • Package Description:

    LEAD FREE, TO-126, 3 PIN

  • Manufacturer Package Code:

    340AS

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Collector Current-Max (IC):

    5 A

  • Collector-Emitter Voltage-Max:

    60 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    200

  • JEDEC-95 Code:

    TO-126

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    20 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Element Material:

    SILICON

KSD1691GS Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, vias should be placed under the thermal pad to improve heat dissipation.
  • Ensure that the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C. Also, consider the power dissipation and thermal resistance of the device when designing the system.
  • The KSD1691GS has built-in ESD protection, but it is still recommended to follow proper ESD handling procedures during assembly and testing. A minimum of 2kV HBM (Human Body Model) and 200V MM (Machine Model) ESD protection is recommended.
  • Yes, the KSD1691GS is designed to operate in humid environments. However, it is recommended to follow proper moisture sensitivity level (MSL) handling procedures during assembly and storage.
  • Store the devices in a dry, cool place, away from direct sunlight and moisture. The recommended storage temperature range is -40°C to 30°C, and the relative humidity should be below 60%.

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KSD1691GS Overview

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KSD1691GS Alternates

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Part Image 2SD1691L-Y-T6C-K Unisonic Technologies Co Ltd

Power Bipolar Transistor, 5A I(C), 60V V(BR)CEO, 1-Element, NPN, Silicon, TO-126, Plastic/Epoxy, 3 Pin
Part Image 2SD1691G-Y-T6C-K Unisonic Technologies Co Ltd

Power Bipolar Transistor, 5A I(C), 60V V(BR)CEO, 1-Element, NPN, Silicon, TO-126, Plastic/Epoxy, 3 Pin
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Power Bipolar Transistor, 5A I(C), 60V V(BR)CEO, 1-Element, NPN, Silicon, TO-126, Plastic/Epoxy, 3 Pin, TO-126, 3 PIN
Part Image 2SD1691G-Y-TA3-T Unisonic Technologies Co Ltd

Power Bipolar Transistor, 5A I(C), 60V V(BR)CEO, 1-Element, NPN, Silicon, TO-220AB, Plastic/Epoxy, 3 Pin
Part Image KSD1691GSTU onsemi

Power Bipolar Transistor, 5A I(C), 60V V(BR)CEO, 1-Element, NPN, Silicon, TO-126, Plastic/Epoxy, 3 Pin
For a full list of alternate parts for KSD1691GS, check out Findchips.com