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KSH122TF - onsemi

Description: Obsolete - NPN Silicon Darlington Transistor

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PCB Footprints
KSH122TF - onsemi PCB footprint - Other - Other - DPAK3 CASE 369AK ISSUE O
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3D Models
KSH122TF - onsemi  - 3D model - Other - DPAK3 CASE 369AK ISSUE O
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KSH122TF Details

  • Manufacturer Part Number:

    KSH122TF

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DPAK-3

  • Package Description:

    DPAK-3/2

  • Manufacturer Package Code:

    369AK

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Collector Current-Max (IC):

    8 A

  • Collector-Emitter Voltage-Max:

    100 V

  • Configuration:

    DARLINGTON WITH BUILT-IN DIODE AND RESISTOR

  • DC Current Gain-Min (hFE):

    100

  • JEDEC-95 Code:

    TO-252AA

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    20 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

KSH122TF Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a thermal relief pattern and a solid ground plane is recommended. Ensure a minimum of 1 oz copper thickness and a thermal via array under the device to dissipate heat efficiently.
  • Implement a robust thermal management system, including a heat sink, thermal interface material, and a cooling fan if necessary. Ensure the device is operated within the recommended junction temperature (Tj) range of -40°C to 150°C.
  • Handle the device with an anti-static wrist strap or mat. Ensure the PCB is designed with ESD protection in mind, including TVS diodes and resistors. Follow standard ESD handling procedures to prevent damage.
  • Yes, the KSH122TF is AEC-Q101 qualified and suitable for automotive and high-reliability applications. However, ensure you follow the recommended operating conditions, and consult with onsemi's application engineers for specific guidance.
  • Follow the recommended soldering profile: peak temperature 260°C, time above 217°C 60-90 seconds. For rework, use a low-temperature soldering iron (< 350°C) and a solder with a melting point below 217°C.

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KSH122TF Overview

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Part Image MJD122 Motorola Semiconductor Products

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Part Image CJD122 Central Semiconductor Corp

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Part Image MJD122 Fairchild Semiconductor Corporation

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Part Image MJD122-T1 Samsung Semiconductor

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For a full list of alternate parts for KSH122TF, check out Findchips.com