KSH200TF footprint, schematic symbol and 3D model by onsemi

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KSH200TF - onsemi PCB footprint - Other - Other - DPAK3 CASE 369AK ISSUE O

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Part Number KSH200TF
Manufacturer onsemi
Pin Count 3
Part Category Transistor RET NPN
Package Category Other
Footprint Name Other - DPAK3 CASE 369AK ISSUE O
Released Date Jul 26, 2021
Last Modified Date Sep 19, 2024 2:45 PM UTC
Pinout / Pin List Click Here (Member Only)

KSH200TF Details

Manufacturer Part Number:
KSH200TF
Brand Name:
onsemi
Pbfree Code:
Yes
Rohs Code:
Yes
Part Life Cycle Code:
Obsolete
Part Package Code:
DPAK-3
Package Description:
DPAK-3
Manufacturer Package Code:
369AK
ECCN Code:
EAR99
HTS Code:
8541.29.00.75
Factory Lead Time:
4 Weeks
Manufacturer:
onsemi
YTEOL:
0
Collector Current-Max (IC):
5 A
Collector-Emitter Voltage-Max:
25 V
Configuration:
SINGLE WITH BUILT-IN DIODE
DC Current Gain-Min (hFE):
10
JEDEC-95 Code:
TO-252
JESD-30 Code:
R-PSSO-G2
JESD-609 Code:
e3
Moisture Sensitivity Level:
1
Number of Elements:
1
Number of Terminals:
2
Operating Temperature-Max:
150 °C
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Polarity/Channel Type:
NPN
Power Dissipation Ambient-Max:
1.4 W
Power Dissipation-Max (Abs):
12 W
Qualification Status:
Not Qualified
Surface Mount:
YES
Terminal Finish:
MATTE TIN
Terminal Form:
GULL WING
Terminal Position:
SINGLE
Time@Peak Reflow Temperature-Max (s):
30
Transistor Element Material:
SILICON
Transition Frequency-Nom (fT):
65 MHz

KSH200TF Frequently Asked Questions (FAQs)

A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, vias should be placed under the thermal pad to connect to an internal copper plane or a heat sink.
Ensure that the device is operated within the recommended junction temperature (Tj) range of -40°C to 150°C. Implement a thermal management system, such as a heat sink or fan, to keep the device temperature below 125°C. Monitor the device's thermal resistance (RthJA) and adjust the system design accordingly.
The KSH200TF has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is stored in an ESD-protected environment.
Yes, the KSH200TF is qualified for automotive and high-reliability applications. It meets the requirements of AEC-Q101 and is PPAP capable. However, additional testing and validation may be required for specific applications.
Use a systematic approach to troubleshoot issues. Check the device's pinout and connections, ensure proper power supply and decoupling, and verify that the device is operated within its recommended specifications. Use oscilloscopes or logic analyzers to debug signal integrity issues.

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KSH200TF Overview

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