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KSH47TF - onsemi

Description: Obsolete - NPN Epitaxial Silicon Transistor

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KSH47TF - onsemi PCB footprint - Other - Other - DPAK3 CASE 369AK ISSUE O
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KSH47TF - onsemi  - 3D model - Other - DPAK3 CASE 369AK ISSUE O
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KSH47TF Details

  • Manufacturer Part Number:

    KSH47TF

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DPAK-3

  • Package Description:

    DPAK-3

  • Manufacturer Package Code:

    369AK

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    2 Days

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    HIGH RELIABILITY

  • Collector Current-Max (IC):

    1 A

  • Collector-Emitter Voltage-Max:

    250 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    10

  • JEDEC-95 Code:

    TO-252

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    15 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    10 MHz

KSH47TF Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to use a 2-layer or 4-layer board with a solid ground plane on the bottom layer, and to place thermal vias under the device to dissipate heat efficiently.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating temperature range, use a suitable thermal interface material, and ensure good airflow around the device. Additionally, consider using a heat sink or a thermal management system to keep the device within its operating temperature range.
  • Exceeding the maximum junction temperature (Tj) rating can lead to reduced device lifespan, decreased performance, and potentially even device failure. It's crucial to ensure that the device operates within its specified temperature range to maintain reliability and performance.
  • To handle ESD protection for the KSH47TF, follow proper handling and storage procedures, use ESD-protective packaging and materials, and consider implementing ESD protection circuits or devices in the system design.
  • The recommended soldering conditions for the KSH47TF are a peak temperature of 260°C, a soldering time of 10 seconds or less, and a soldering method that follows the IPC J-STD-020 standard.

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KSH47TF Overview

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