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KTR10EZPJ185 - ROHM Semiconductor

Description: Thick Film Resistors - SMD 0805 1.8MOhm 5% High VoltageAEC-Q200

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KTR10EZPJ185 - ROHM Semiconductor - PCB symbol
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KTR10EZPJ185 - ROHM Semiconductor PCB footprint - Resistor Chip - Resistor Chip - KTR10
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KTR10EZPJ185 - ROHM Semiconductor - 3D model - Resistor Chip - KTR10
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KTR10EZPJ185 Details

  • Manufacturer Part Number:

    KTR10EZPJ185

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Philippines, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    10

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.55 mm

  • Package Length:

    2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, PAPER, 7 INCH

  • Rated Power Dissipation (P):

    0.125 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    1800000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0805

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    200 ppm/°C

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    5%

  • Working Voltage:

    400 V

KTR10EZPJ185 Frequently Asked Questions (FAQs)

  • ROHM recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • To ensure reliable operation in high-temperature environments, it is recommended to derate the power dissipation according to the temperature derating curve provided in the datasheet. Additionally, ensure good thermal design and heat dissipation measures are in place.
  • ROHM recommends a soldering profile with a peak temperature of 260°C, a dwell time of 10-30 seconds, and a cooling rate of 4°C/s or less. Refer to the ROHM soldering guidelines for more information.
  • The KTR10EZPJ185 is not designed for use in high-humidity environments. If operation in high humidity is required, consider using a component with a higher moisture sensitivity level or taking additional precautions such as conformal coating or hermetic sealing.
  • ROHM recommends storing the KTR10EZPJ185 in a dry, cool place with a temperature range of 5°C to 30°C and a relative humidity of 60% or less. Avoid storing the component in direct sunlight or near heat sources.

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KTR10EZPJ185 Overview

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