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KTR10EZPJ301 - ROHM Semiconductor

Description: Thick Film Resistors - SMD 0805 300ohm 5% High VoltageAEC-Q200

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KTR10EZPJ301 - ROHM Semiconductor PCB footprint - Resistor Chip - Resistor Chip - KTR10
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KTR10EZPJ301 - ROHM Semiconductor  - 3D model - Resistor Chip - KTR10
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KTR10EZPJ301 Details

  • Manufacturer Part Number:

    KTR10EZPJ301

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Philippines, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    9

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.55 mm

  • Package Length:

    2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, PAPER, 7 INCH

  • Rated Power Dissipation (P):

    0.125 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    300 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0805

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    200 ppm/°C

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    5%

  • Working Voltage:

    400 V

KTR10EZPJ301 Frequently Asked Questions (FAQs)

  • ROHM recommends a thermal pad size of at least 2.5mm x 2.5mm, with multiple vias to the ground plane to ensure efficient heat dissipation. A minimum of 3mm clearance around the device is also recommended to prevent thermal interference.
  • To ensure reliability, ROHM recommends operating the device within the specified temperature range (-40°C to 150°C). Additionally, consider using a thermal interface material (TIM) to improve heat transfer between the device and the heat sink, and ensure proper PCB design and layout for thermal management.
  • The maximum allowable power dissipation for the KTR10EZPJ301 is 1.5W. However, this value can vary depending on the operating temperature and PCB design. It's essential to perform thermal simulations and calculations to ensure the device operates within safe limits.
  • While the KTR10EZPJ301 is designed to operate in a wide range of temperatures, it's not specifically designed for high-humidity environments. ROHM recommends taking precautions to prevent moisture ingress, such as using a conformal coating or potting the device, to ensure reliable operation.
  • ROHM recommends storing the KTR10EZPJ301 in a dry, cool place (temperature range: 5°C to 30°C, humidity: 60% or less) to prevent damage or degradation. Avoid exposing the device to direct sunlight, moisture, or extreme temperatures during storage.

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KTR10EZPJ301 Overview

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