ROHM recommends a thermal pad size of at least 2.5mm x 2.5mm, with a minimum of 1oz copper thickness and a thermal via diameter of 0.3mm to 0.5mm, spaced 1.2mm apart, to ensure efficient heat dissipation.
To ensure reliability, follow the recommended derating curves for temperature and power dissipation, and consider using a heat sink or thermal interface material to maintain a safe junction temperature (Tj) below 150°C.
ROHM recommends a soldering profile with a peak temperature of 260°C, a dwell time above 240°C of 20-30 seconds, and a total process time of 60-90 seconds to prevent thermal damage to the device.
While the KTR18EZPJ102 is not specifically designed for high-humidity environments, it can still be used with proper precautions, such as applying a moisture-resistant coating or conformal coating, and ensuring good PCB design practices to prevent moisture ingress.
To troubleshoot issues, check the PCB layout and thermal design, ensure proper soldering and assembly, verify the input voltage and current, and use a thermal camera or thermometer to monitor the device temperature. Consult ROHM's application notes and technical support for further assistance.
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KTR18EZPJ102 Overview
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