ROHM recommends a thermal pad size of 2.5mm x 2.5mm with a thermal via diameter of 0.3mm, and a minimum of 5 thermal vias. Additionally, a solid copper fill on the top and bottom layers can help improve thermal dissipation.
To ensure reliable operation, ROHM recommends derating the power dissipation according to the ambient temperature. For example, at 125°C, the maximum power dissipation should be derated to 60% of the maximum rating. Additionally, using a heat sink or thermal interface material can help reduce the junction temperature.
ROHM recommends a soldering profile with a peak temperature of 260°C, a dwell time above 220°C of 30 seconds, and a total process time of 60 seconds. It's also important to follow the IPC-J-STD-020 standard for reflow soldering.
The KTR18EZPJ564 is not designed for use in high-humidity environments. ROHM recommends using a moisture-resistant coating or conformal coating to protect the device from moisture. Additionally, the device should be stored in a dry environment with a relative humidity below 60%.
ROHM recommends handling the device by the edges to prevent damage to the pins. The device should be stored in a dry, clean environment with a relative humidity below 60%. It's also important to avoid bending or flexing the leads during handling and storage.
Trust Checks
This model has been generated by a fully automated process.
Machine Generated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
KTR18EZPJ564 Overview
Use the download button to access the KTR18EZPJ564 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like KTR18,
or try a keyword search, such as Fixed Resistors
