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KW45B41Z82AFPBR - NXP

Description: RF Microcontrollers - MCU K4W1 HVQFN40

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KW45B41Z82AFPBR Details

  • Manufacturer Part Number:

    KW45B41Z82AFPBR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    VQFN-40

  • HTS Code:

    8542.31.00.30

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    12

  • JESD-30 Code:

    S-PQCC-N40

  • Length:

    6 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    40

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC40,.24SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, VERY THIN PROFILE, HEAT SINK/SLUG

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max:

    1.21 V

  • Supply Voltage-Min:

    1.04 V

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    6 mm

  • uPs/uCs/Peripheral ICs Type:

    RFSoC

KW45B41Z82AFPBR Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout guide in their application note AN12073, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • NXP provides a Secure Boot and Secure Firmware Update solution through their MCUXpresso SDK, which includes tools and libraries to implement secure boot, encryption, and secure firmware updates. Additionally, NXP's Secure Boot and Secure Firmware Update Application Note (AN12413) provides detailed guidance on implementation.
  • The KW45B41Z82AFPBR has a maximum operating temperature of 105°C. To ensure reliable operation, it's essential to implement proper thermal management, including heat sinking, thermal interface materials, and airflow management. NXP's Thermal Management Application Note (AN12295) provides guidance on thermal design and simulation.
  • The KW45B41Z82AFPBR has various power modes, including low-power modes, which can be optimized using NXP's Power Management API and Low Power Mode Application Note (AN12411). Additionally, optimizing clock frequencies, disabling unused peripherals, and using power gating techniques can help reduce power consumption.
  • To ensure EMC and EMI compliance, it's essential to follow NXP's EMC and EMI guidelines, including proper PCB layout, component selection, and shielding. NXP's EMC and EMI Application Note (AN12294) provides detailed guidance on design considerations and testing.

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KW45B41Z82AFPBR Overview

Use the download button to access the KW45B41Z82AFPBR 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like KW45B, or try a keyword search, such as Other uPs/uCs/Peripheral ICs

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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