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KW45B41Z83AFTBR - NXP

Description: Highly Secure, Bluetooth Low Energy 5.3 Wireless MCU with CAN FD

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Symbol
KW45B41Z83AFTBR - NXP - PCB symbol
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PCB Footprints
KW45B41Z83AFTBR - NXP PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - HVQFN48 (SOT619-17(D))
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3D Models
KW45B41Z83AFTBR - NXP - 3D model - Quad Flat No-Lead - HVQFN48 (SOT619-17(D))
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KW45B41Z83AFTBR Details

  • Manufacturer Part Number:

    KW45B41Z83AFTBR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HVQFN-48

  • HTS Code:

    8542.31.00.30

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    12

  • JESD-30 Code:

    S-PQCC-N48

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC48,.28SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, VERY THIN PROFILE, HEAT SINK/SLUG

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max:

    1.21 V

  • Supply Voltage-Min:

    1.04 V

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    7 mm

  • uPs/uCs/Peripheral ICs Type:

    RFSoC

KW45B41Z83AFTBR Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout guide in the application note AN12073, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • To minimize power consumption, configure the device to use the lowest possible clock frequency, disable unnecessary peripherals, and use the low-power modes (e.g., sleep, deep sleep) when the device is not actively transmitting or receiving data. Additionally, optimize the transmit power level and data transmission frequency to reduce energy consumption.
  • The antenna design and placement are critical for optimal RF performance. NXP recommends using a 50-ohm impedance-matched antenna, and placing it at least 10 mm away from other components to minimize interference. The application note AN12073 provides more detailed guidelines for antenna design and placement.
  • NXP provides a secure boot mechanism and firmware update process through the KW45's cryptographic engine and secure boot loader. Implement secure boot by generating a secure boot key, signing the firmware image, and configuring the boot loader to verify the signature. For secure firmware updates, use a secure communication protocol (e.g., HTTPS) and authenticate the update package using digital signatures.
  • The KW45B41Z83AFTBR has a maximum operating temperature of 85°C. To ensure reliable operation, provide adequate heat dissipation through a heat sink, thermal vias, or a thermal pad. Avoid exposing the device to high temperatures during reflow soldering, and ensure that the PCB design allows for good airflow and heat dissipation.

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KW45B41Z83AFTBR Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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