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L-ASC10-1SG48ITR - Lattice Semiconductor

Description: In-System Programmable Hardware Management Expander

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PCB Footprints
L-ASC10-1SG48ITR - Lattice Semiconductor PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 48-Pin QFN
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3D Models
L-ASC10-1SG48ITR - Lattice Semiconductor  - 3D model - Quad Flat No-Lead - 48-Pin QFN
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L-ASC10-1SG48ITR Details

  • Manufacturer Part Number:

    L-ASC10-1SG48ITR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    QFN-48

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.01

  • Manufacturer:

    Lattice Semiconductor Corporation

  • YTEOL:

    8

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    S-XQCC-N48

  • Length:

    7 mm

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.8 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    7 mm

L-ASC10-1SG48ITR Frequently Asked Questions (FAQs)

  • The recommended PCB layout and routing for optimal performance can be found in the Lattice Semiconductor Corporation's FPGA PCB Design and Layout Guidelines document, which provides detailed guidelines for PCB design, layer stackup, and routing.
  • A reliable and efficient power-up sequence for the FPGA can be achieved by following the power-up sequence guidelines provided in the Lattice Semiconductor Corporation's Power-Up and Power-Down Sequence document, which outlines the recommended sequence for powering up the FPGA.
  • Best practices for thermal management and heat dissipation for the FPGA include using a heat sink, ensuring good airflow, and following the thermal design guidelines provided in the Lattice Semiconductor Corporation's Thermal Management document.
  • To ensure signal integrity and minimize signal degradation, follow the signal integrity guidelines provided in the Lattice Semiconductor Corporation's Signal Integrity document, which outlines best practices for signal routing, termination, and impedance matching.
  • Recommended design practices for achieving low power consumption include using power-aware design techniques, optimizing clock frequencies, and using low-power modes, as outlined in the Lattice Semiconductor Corporation's Low Power Design document.

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L-ASC10-1SG48ITR Overview

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