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L2N7002DW1T1G - LRC

Description: Trans MOSFET Array Dual N-CH 60V ±0.115A 6-Pin SC-88 T/R

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PCB Footprints
L2N7002DW1T1G - LRC PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - SC88(SOT-363)
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3D Models
L2N7002DW1T1G - LRC  - 3D model - SOT23 (6-Pin) - SC88(SOT-363)
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L2N7002DW1T1G Details

  • Manufacturer Part Number:

    L2N7002DW1T1G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HALOGEN FREE AND ROHS COMPLIANT, 419B-02, SC-88, 6 PIN

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    LRC Leshan Radio Co Ltd

  • YTEOL:

    6.5

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    0.115 A

  • Drain-source On Resistance-Max:

    7.5 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    5 pF

  • JESD-30 Code:

    R-PDSO-G6

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    0.38 W

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Transistor Element Material:

    SILICON

L2N7002DW1T1G Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for L2N7002DW1T1G is -40°C to 125°C.
  • Yes, L2N7002DW1T1G is compatible with lead-free soldering, making it suitable for RoHS-compliant designs.
  • The maximum power dissipation for L2N7002DW1T1G is 2.5W, making it suitable for low-power applications.
  • Yes, L2N7002DW1T1G is suitable for high-frequency applications up to 1 GHz, making it suitable for wireless communication systems.
  • Yes, L2N7002DW1T1G is available in a reel package, making it suitable for automated assembly and high-volume production.

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