3D Models
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- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for L6008D8RP
- Part Number L6008D8RP
- Manufacturer LITTELFUSE
- Last Modified Date Oct 6, 2025 1:29 PM UTC
- Pinout / Pin List Click Here (Member Only)
L6008D8RP Details
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Manufacturer Part Number:
L6008D8RP
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Pbfree Code:
No
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Part Package Code:
TO-252AA
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Pin Count:
3
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ECCN Code:
EAR99
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HTS Code:
8541.30.00.80
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Manufacturer:
Littelfuse Inc
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YTEOL:
6
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Additional Feature:
HIGH RELIABILITY
L6008D8RP Frequently Asked Questions (FAQs)
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The recommended PCB layout for optimal thermal performance involves placing the device on a thermal pad with a minimum size of 20mm x 20mm, and ensuring good thermal conductivity between the pad and the surrounding copper area. Additionally, it's recommended to use a minimum of 2oz copper thickness and to avoid placing any thermal vias under the device.
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To ensure reliable operation in high-temperature environments, it's essential to follow the recommended derating curves for the device. Additionally, ensure good airflow around the device, and consider using a heat sink or thermal interface material to reduce the junction temperature. It's also important to follow proper soldering and assembly techniques to prevent thermal interface resistance.
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Exceeding the maximum surge current rating can lead to device failure, including thermal runaway, melting of the internal components, or even catastrophic failure. It's essential to ensure that the device is operated within the specified surge current rating to prevent damage and ensure reliable operation.
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To select the correct fuse for your application, consider the following factors: maximum voltage, maximum current, and the type of fault protection required (e.g., overcurrent, overvoltage, or short-circuit). Additionally, consider the environmental conditions, such as temperature and humidity, and the desired response time for fault detection.
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When using the L6008D8RP in a high-reliability application, consider the following factors: device qualification and testing, manufacturing quality, and component traceability. Additionally, ensure that the device is operated within the specified ratings and follows the recommended application guidelines to minimize the risk of failure.
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L6008D8RP Overview
Use the download button to access the L6008D8RP 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
