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L6382DTR - STMicroelectronics

Description: Power Management Unit for Microcontrolled Ballast

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L6382DTR - STMicroelectronics - PCB symbol
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L6382DTR - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - SO-20---0999
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L6382DTR - STMicroelectronics - 3D model - Small Outline Packages - SO-20---0999
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L6382DTR Details

  • Manufacturer Part Number:

    L6382DTR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    SOP-20

  • Pin Count:

    20

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    45 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    8

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e4

  • Length:

    12.8 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP20,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Max (Vsup):

    15 V

  • Supply Voltage-Min (Vsup):

    9 V

  • Supply Voltage-Nom (Vsup):

    12 V

  • Surface Mount:

    YES

  • Technology:

    BCDMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.5 mm

L6382DTR Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the L6382DTR is -40°C to 150°C, but it's recommended to operate within -20°C to 125°C for optimal performance.
  • To ensure proper power-up and initialization, make sure to follow the recommended power-up sequence, which is to apply VCC first, then VBOOT, and finally the input signals. Also, ensure that the input signals are stable and within the recommended voltage range.
  • For optimal performance, it's recommended to follow a 4-layer PCB design with a dedicated power plane, and to keep the high-frequency components (such as the bootstrap capacitor and the gate resistor) close to the IC. Also, ensure that the PCB layout is symmetrical and balanced to minimize electromagnetic interference (EMI).
  • To troubleshoot issues with the L6382DTR, start by checking the input signals, power supply, and PCB layout for any errors or inconsistencies. Use an oscilloscope to monitor the output voltage and current, and check for any signs of oscillation or instability. Also, ensure that the component values and layout meet the recommended specifications.
  • Yes, the L6382DTR is designed to meet the requirements of high-reliability and safety-critical applications, such as automotive and industrial systems. However, it's essential to follow the recommended design and testing guidelines, and to perform thorough validation and verification to ensure the device meets the specific application requirements.

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L6382DTR Overview

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To find more CAD model downloads similar to this part, try a partial part number search, like L6382, or try a keyword search, such as Power Management Circuits

About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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