Littelfuse recommends a PCB layout with a large copper area connected to the thermal tab of the device to dissipate heat efficiently. A minimum of 1 oz copper thickness and a thermal relief pattern around the device are also recommended.
To ensure reliability, Littelfuse recommends following the derating curves provided in the datasheet, using a suitable thermal interface material, and ensuring good airflow around the device. Additionally, consider using a thermally conductive pad or heat sink to reduce the junction temperature.
The L70S100.V is designed to withstand surge currents up to 100 A for 10 ms, as specified in the datasheet. However, it's essential to consider the specific application requirements and ensure that the device is not subjected to repetitive surges that may affect its reliability.
Yes, L70S100.V can be used in parallel to increase the current rating. However, it's crucial to ensure that the devices are matched in terms of their electrical characteristics, and that the PCB layout is designed to minimize current imbalance and thermal mismatch between the devices.
Littelfuse recommends storing the L70S100.V in its original packaging, away from direct sunlight, moisture, and extreme temperatures. When handling the device, use anti-static wrist straps or mats to prevent electrostatic discharge (ESD) damage.
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L70S100.V Overview
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