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L777TSE09POL2 - Amphenol

Description: Dsub, Stamped Signal 3A, Straight PCB Thru Hole Low Profile, Height=6.02mm(0.237in), 9 Pin, Bright Tin Shell+Grounding Dimples, 0.38m(15 in) Gold, 3.05mm (0.120in) Clear Hole

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PCB Footprints
L777TSE09POL2 - Amphenol PCB footprint - Other - Other - L777TSE09POL2-4
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3D Models
L777TSE09POL2 - Amphenol  - 3D model - Other - L777TSE09POL2-4
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L777TSE09POL2 Details

  • Manufacturer Part Number:

    L777TSE09POL2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    ROHS COMPLIANT

  • ECCN Code:

    EAR99

  • HTS Code:

    8536.69.40.30

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Amphenol Corporation

  • YTEOL:

    8.5

  • Additional Feature:

    STANDARD: MIL-C-24308

  • Body/Shell Style:

    PLUG

  • Connector Type:

    D SUBMINIATURE CONNECTOR

  • Contact Finish Mating:

    GOLD (15)

  • Contact Finish Termination:

    GOLD

  • Contact Gender:

    MALE

  • Contact Material:

    COPPER ALLOY

  • DIN Conformance:

    NO

  • Empty Shell:

    NO

  • Filter Feature:

    NO

  • IEC Conformance:

    NO

  • Insulator Material:

    GLASS FILLED POLYETHYLENE

  • JESD-609 Code:

    e4

  • MIL Conformance:

    YES

  • Mating Information:

    MULTIPLE MATING PARTS AVAILABLE

  • Mixed Contacts:

    NO

  • Mounting Type:

    BOARD AND PANEL

  • Option:

    GENERAL PURPOSE

  • Shell Finish:

    NICKEL

  • Shell Material:

    STEEL

  • Shell Size:

    1/E

  • Termination Type:

    SOLDER

  • Total Number of Contacts:

    9

  • UL Flammability Code:

    94V-0

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L777TSE09POL2 Overview

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About Amphenol

Amphenol Corporation is one of the largest manufacturers of interconnect products in the world. Amphenol designs, manufactures, and markets electrical, electronic, and fiber optic connectors, cable assemblies, and interconnect systems. The company serves a wide range of industries, including aerospace, automotive, telecommunications, military and defense, industrial, and consumer electronics.

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