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La1238x7s88ab - NXP

Description: Layerscape® Access LA12xx Programmable Baseband Processor, plastic, fine-pitch ball grid array package; 621 balls; 0.8 mm pitch; 21 mm x 21 mm x 2.37 mm body

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Symbol
La1238x7s88ab - NXP - PCB symbol
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PCB Footprints
La1238x7s88ab - NXP PCB footprint - BGA - BGA - SOT2037-1_2026
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3D Models
La1238x7s88ab - NXP - 3D model - BGA - SOT2037-1_2026
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La1238x7s88ab Details

  • Manufacturer Part Number:

    LA1238X7S88AB

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    13

  • Moisture Sensitivity Level:

    3

  • Peak Reflow Temperature (Cel):

    250

  • Time@Peak Reflow Temperature-Max (s):

    30

  • uPs/uCs/Peripheral ICs Type:

    SoC

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La1238x7s88ab Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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