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LA72912V-TLM-H - onsemi

Description: LA72912V-TLM-H, RF Transceiver 10.9 → 12.1MHz, 4.7 → 5.5 V 24-Pin SSOP

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Symbol
LA72912V-TLM-H - onsemi - PCB symbol
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PCB Footprints
LA72912V-TLM-H - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SSOP24 (275mil)
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3D Models
LA72912V-TLM-H - onsemi - 3D model - Small Outline Packages - SSOP24 (275mil)
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LA72912V-TLM-H Details

  • Manufacturer Part Number:

    LA72912V-TLM-H

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SSOP-24

  • Pin Count:

    24

  • Manufacturer Package Code:

    565AQ

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Consumer IC Type:

    CONSUMER CIRCUIT

  • JESD-30 Code:

    R-PDSO-G24

  • JESD-609 Code:

    e6

  • Length:

    8.02 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    70 °C

  • Operating Temperature-Min:

    -30 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.5 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.7 V

  • Surface Mount:

    YES

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    TIN BISMUTH

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5.6 mm

LA72912V-TLM-H Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout. Also, consider derating the device's power handling at high temperatures.
  • The LA72912V-TLM-H has built-in ESD protection diodes. However, it's still recommended to follow proper ESD handling procedures during assembly and use ESD-protective packaging. For latch-up prevention, ensure that the device is operated within the recommended voltage and current ranges.
  • Yes, the LA72912V-TLM-H is AEC-Q100 qualified and suitable for high-reliability and automotive applications. However, ensure that you follow the recommended operating conditions, and consult with onsemi's application engineers for specific requirements.
  • Follow the recommended soldering profile: peak temperature 260°C, time above 217°C 60s max. For rework, use a low-temperature soldering iron and avoid applying excessive heat or force to the device.

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LA72912V-TLM-H Overview

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