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LAN7850/8JX - Microchip

Description: USB Interface IC U2/HSIC to GigE w/PHY

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LAN7850/8JX Details

  • Manufacturer Part Number:

    LAN7850/8JX

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    56

  • Manufacturer Package Code:

    VQFN-56

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    15 Weeks

  • Date Of Intro:

    2016-10-20

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    19

  • Boundary Scan:

    YES

  • Bus Compatibility:

    USB

  • Clock Frequency-Max:

    25 MHz

  • Communication Protocol:

    ASYNC, BIT; SYNC, BYTE

  • Data Transfer Rate-Max:

    125 MBps

  • JESD-30 Code:

    S-PQCC-N56

  • JESD-609 Code:

    e3

  • Length:

    8 mm

  • Low Power Mode:

    YES

  • Number of Serial I/Os:

    2

  • Number of Terminals:

    56

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC56,.31SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Seated Height-Max:

    1 mm

  • Supply Current-Max:

    183 mA

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.1 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    8 mm

  • uPs/uCs/Peripheral ICs Type:

    SERIAL IO/COMMUNICATION CONTROLLER, LAN

LAN7850/8JX Frequently Asked Questions (FAQs)

  • Microchip provides a recommended PCB layout guide in the LAN7850/8JX evaluation board user's guide, which includes guidelines for component placement, routing, and thermal management.
  • To optimize the LAN7850/8JX for low power consumption, use the power-saving features such as Energy Efficient Ethernet (EEE), adaptive voltage scaling, and dynamic frequency scaling. Additionally, optimize the system design to minimize power consumption during idle periods.
  • The LAN7850/8JX has a thermal junction-to-ambient thermal resistance of 24°C/W. Ensure good airflow, use thermal vias, and consider heat sinks or thermal interfaces to maintain a safe operating temperature.
  • Use the Microchip LAN7850/8JX evaluation board and the Microchip LANCheck™ tool to troubleshoot issues. Also, consult the LAN7850/8JX datasheet, application notes, and Microchip's technical support resources.
  • Follow the EMI and EMC guidelines in the LAN7850/8JX datasheet and application notes. Use proper PCB layout, shielding, and filtering to minimize electromagnetic interference and ensure electromagnetic compatibility.

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LAN7850/8JX Overview

Use the download button to access the LAN7850/8JX 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like LAN78, or try a keyword search, such as Serial IO/Communication Controllers

About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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