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LAN8700I-AEZG - SMSC

Description: ±15kV ESD Protected MII/RMII Fast-Ethernet PHY with HP Auto-MDIX & SMSC flexPWRTM in a Small Footprint

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PCB Footprints
LAN8700I-AEZG - SMSC PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 36-Pin QFN Package Outline, 6 x 6 x 0.90 mm Body (Lead-Free)
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3D Models
LAN8700I-AEZG - SMSC  - 3D model - Quad Flat No-Lead - 36-Pin QFN Package Outline, 6 x 6 x 0.90 mm Body (Lead-Free)
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LAN8700I-AEZG Details

  • Manufacturer Part Number:

    LAN8700I-AEZG

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Part Package Code:

    QFN

  • Package Description:

    6 X 6 MM, 0.90 MM HEIGHT, ROHS COMPLIANT, QFN-36

  • Pin Count:

    36

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    SMSC

  • Boundary Scan:

    NO

  • Clock Frequency-Max:

    25 MHz

  • Data Encoding/Decoding Method:

    NRZI; BIPH-LEVEL(MANCHESTER)

  • Data Transfer Rate-Max:

    12.5 MBps

  • JESD-30 Code:

    S-XQCC-N36

  • JESD-609 Code:

    e3

  • Length:

    6 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of Serial I/Os:

    1

  • Number of Terminals:

    36

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max:

    3.63 V

  • Supply Voltage-Min:

    2.97 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    6 mm

  • uPs/uCs/Peripheral ICs Type:

    SERIAL IO/COMMUNICATION CONTROLLER, LAN

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