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LB11685AV-TLM-H - onsemi

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LB11685AV-TLM-H - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SSOP24J(275mil)
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LB11685AV-TLM-H - onsemi  - 3D model - Small Outline Packages - SSOP24J(275mil)
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LB11685AV-TLM-H Details

  • Manufacturer Part Number:

    LB11685AV-TLM-H

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SSOP-24

  • Pin Count:

    24

  • Manufacturer Package Code:

    565AS

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Analog IC - Other Type:

    3-PHASE BRUSHLESS DC MOTOR CONTROLLER

  • JESD-30 Code:

    R-PDSO-G24

  • JESD-609 Code:

    e6

  • Length:

    9.75 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    1.2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    SOP24,.3,32

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.5 mm

  • Supply Current-Max (Isup):

    20 mA

  • Supply Voltage-Max (Vsup):

    18 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Bismuth (Sn/Bi)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5.6 mm

LB11685AV-TLM-H Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the IC.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure proper PCB design, component selection, and soldering techniques.
  • The critical timing parameters include the input rise and fall times, output delay, and propagation delay. Refer to the datasheet for specific values and ensure your design meets these requirements.
  • Implement ESD protection devices, such as TVS diodes or ESD arrays, on the input and output pins. Ensure proper PCB layout and component selection to minimize ESD susceptibility.
  • Follow the recommended power-up and power-down sequences outlined in the datasheet. Ensure a slow and controlled voltage ramp-up (typically 1-10 ms) to prevent damage or latch-up.

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LB11685AV-TLM-H Overview

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Part Image LB11685AV-MPB-H onsemi

3-PHASE BRUSHLESS DC MOTOR CONTROLLER, 1.2A, PDSO24