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- Stock & Prices $ Price & Stock for LB11876-TLM-E
- Part Number LB11876-TLM-E
- Manufacturer onsemi
- Pin Count 36
- Part Category Motor
- Package Category Small Outline Packages
- Footprint Name Small Outline Packages - On-Semiconductor
- Released Date Oct 16, 2017
- Last Modified Date Mar 7, 2023 4:10 PM UTC
- Pinout / Pin List Click Here (Member Only)
LB11876-TLM-E Details
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Manufacturer Part Number:
LB11876-TLM-E
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Brand Name:
ON Semiconductor
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Pbfree Code:
Yes
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Rohs Code:
Yes
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Part Life Cycle Code:
Obsolete
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Package Description:
0.275 INCH, SSOP-36
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Pin Count:
36
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Manufacturer Package Code:
565AU
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ECCN Code:
EAR99
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HTS Code:
8542.39.00.60
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Factory Lead Time:
4 Weeks
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Manufacturer:
onsemi
LB11876-TLM-E Frequently Asked Questions (FAQs)
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A good PCB layout for optimal thermal performance involves placing thermal vias under the IC, using a solid ground plane, and keeping the thermal path as short as possible. It's also recommended to use a thermal pad on the bottom of the IC and connect it to a thermal plane or a heat sink.
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To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating temperature range, use a suitable heat sink, and ensure good airflow around the IC. Additionally, consider using thermal interface materials and following proper PCB design guidelines for thermal management.
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Exceeding the maximum junction temperature (Tj) rating can lead to reduced lifespan, decreased performance, and even permanent damage to the IC. It's crucial to ensure that the IC operates within the recommended temperature range to maintain reliability and performance.
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To troubleshoot issues related to the IC's internal voltage regulator, check the input voltage, output voltage, and current consumption. Verify that the input voltage is within the recommended range, and ensure that the output voltage is stable and within the specified tolerance. Also, check for any signs of overheating or excessive current consumption.
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The LB11876-TLM-E has built-in ESD protection and latch-up prevention measures, including internal ESD diodes and protection circuits. However, it's still essential to follow proper handling and assembly procedures to prevent ESD damage. Additionally, ensure that the IC is properly connected to a ground plane and follow recommended PCB design guidelines.
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LB11876-TLM-E Overview
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