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LB1830MC-AH - onsemi

Description: ON Semiconductor LB1830MC-AH, Fan Controller Bidirectional Motor, 10-Pin SOIC

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LB1830MC-AH - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC10 3426A
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LB1830MC-AH - onsemi  - 3D model - Small Outline Packages - SOIC10 3426A
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LB1830MC-AH Details

  • Manufacturer Part Number:

    LB1830MC-AH

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SOIC-10

  • Pin Count:

    10

  • Manufacturer Package Code:

    751BQ

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Analog IC - Other Type:

    3-PHASE BRUSHLESS DC MOTOR CONTROLLER

  • JESD-30 Code:

    R-PDSO-G10

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    80 °C

  • Operating Temperature-Min:

    -20 °C

  • Output Current-Max:

    0.5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SOP10,.25,40

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max (Isup):

    8 mA

  • Supply Voltage-Max (Vsup):

    9 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    6 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    COMMERCIAL EXTENDED

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

LB1830MC-AH Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or a heat sink to dissipate heat efficiently.
  • Monitor the device's junction temperature (TJ) and ensure it stays within the recommended range of -40°C to 150°C. Also, ensure the input voltage (VIN) is within the recommended range of 2.5V to 5.5V.
  • A 10uF to 22uF ceramic capacitor (X5R or X7R dielectric) is recommended for input decoupling. The capacitor should be placed as close to the VIN pin as possible.
  • Use a shielded inductor, keep the PCB layout compact, and use a common-mode choke or ferrite bead to filter the output. Also, ensure the device is placed away from noise-sensitive components.
  • A 10uF to 22uF ceramic capacitor (X5R or X7R dielectric) is recommended for output filtering. The capacitor should be placed as close to the VOUT pin as possible.

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