Please enter a minimum 3 letters or numbers
Technical Content
Part Image

LB2012T6R8M - TAIYO YUDEN

Description: Inductor General Purpose Chip Wirewound 6.8uH 20% 7.96MHz Ferrite 0.135A 0.611Ohm DCR 0805 T/R

Download LB2012T6R8M Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
Send part feedback
Symbol
LB2012T6R8M - TAIYO YUDEN - PCB symbol
click to zoom
PCB Footprints
LB2012T6R8M - TAIYO YUDEN PCB footprint - Inductors Chip - Inductors Chip - ST715C33R
click to zoom
3D Models
LB2012T6R8M - TAIYO YUDEN - 3D model - Inductors Chip - ST715C33R
click to zoom

LB2012T6R8M Details

  • Manufacturer Part Number:

    LB2012T6R8M

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    TAIYO YUDEN

  • YTEOL:

    7

  • Case/Size Code:

    0805

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.611 Ω

  • Inductance-Nom (L):

    6.8 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    1.25 mm

  • Package Length:

    2 mm

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, EMBOSSED, 7 INCH

  • Rated Current-Max:

    0.135 A

  • Self Resonance Frequency:

    38 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Special Feature:

    DCR IS MEASURED AT 30% TOLERANCE

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    7.96 MHz

  • Tolerance:

    20%

LB2012T6R8M Frequently Asked Questions (FAQs)

  • The recommended land pattern for LB2012T6R8M is a rectangular pad with a size of 2.5mm x 1.25mm, with a non-solder mask defined (NSMD) pad shape.
  • The LB2012T6R8M is a moisture-sensitive device. It is recommended to store the component in a dry environment (less than 20% RH) and to bake the component at 125°C for 24 hours before reflow soldering if it has been exposed to moisture for more than 168 hours.
  • The maximum reflow temperature for LB2012T6R8M is 260°C, with a peak temperature of 250°C for a maximum of 10 seconds.
  • Yes, the LB2012T6R8M is designed to withstand high-vibration environments. However, it is recommended to follow the manufacturer's guidelines for vibration testing and to ensure that the component is properly secured to the PCB.
  • To ensure the reliability of the LB2012T6R8M in a high-temperature environment, it is recommended to follow the manufacturer's guidelines for temperature derating and to ensure that the component is properly cooled.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

LB2012T6R8M Overview

Use the download button to access the LB2012T6R8M schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like LB201, or try a keyword search, such as Fixed Inductors

Parts related to LB2012T6R8M

Showing 0 results

Part Image

← Prev Next →
About Us Contact Us Terms of Service Do not sell or share my personal information Privacy Policy Digital Services Act Library Loader Twitter LinkedIn

All content Copyright © 2020, Supplyframe.com. All rights reserved. Back to top ↑