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LC05111C13MTTTG - onsemi

Description: Battery Management 1CELL LIB PROTECTION IC

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PCB Footprints
LC05111C13MTTTG - onsemi PCB footprint - Other - Other - WDFN6 2.6x4.0, 0.65P, Dual Flag CASE 511BZ ISSUE B
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3D Models
LC05111C13MTTTG - onsemi  - 3D model - Other - WDFN6 2.6x4.0, 0.65P, Dual Flag CASE 511BZ ISSUE B
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LC05111C13MTTTG Details

  • Manufacturer Part Number:

    LC05111C13MTTTG

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    WDFN-6

  • Manufacturer Package Code:

    511BZ

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Date Of Intro:

    2017-12-14

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    BATTERY PROTECTOR

  • JESD-30 Code:

    R-PDSO-N6

  • JESD-609 Code:

    e6

  • Length:

    3.8 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC6,.16,25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max (Isup):

    0.006 mA

  • Supply Voltage-Max (Vsup):

    4.3 V

  • Supply Voltage-Min (Vsup):

    2.6 V

  • Supply Voltage-Nom (Vsup):

    3.7 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Bismuth (Sn/Bi)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2.6 mm

LC05111C13MTTTG Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the exposed pad to the ground plane. This helps to dissipate heat efficiently.
  • To ensure reliable operation across the full temperature range, it's essential to follow the recommended operating conditions, including voltage and current ratings. Additionally, consider using thermal management techniques, such as heat sinks or thermal interfaces, to maintain a safe junction temperature.
  • The LC05111C13MTTTG has built-in ESD protection diodes on the input pins, which provide a certain level of protection against electrostatic discharge. However, it's still recommended to follow proper ESD handling procedures during assembly and testing. For latch-up prevention, it's essential to follow the recommended operating conditions and avoid voltage spikes or transients that could trigger latch-up.
  • Yes, the LC05111C13MTTTG is suitable for high-reliability and automotive applications. However, it's essential to follow the recommended operating conditions, and to ensure that the device is properly qualified and validated for the specific application.
  • For optimal assembly and soldering, follow the recommended reflow soldering profile, and ensure that the device is handled and stored in a moisture-controlled environment. It's also recommended to use a soldering iron with a temperature-controlled tip to prevent overheating the device.

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LC05111C13MTTTG Overview

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