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LC5256MV-5FN256C - Lattice Semiconductor

Description: CPLD - Complex Programmable Logic Devices PROGRAM EXPANDED LOG

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LC5256MV-5FN256C - Lattice Semiconductor PCB footprint - BGA - BGA - 256-FPBGA 17x17
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LC5256MV-5FN256C - Lattice Semiconductor  - 3D model - BGA - 256-FPBGA 17x17
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LC5256MV-5FN256C Details

  • Manufacturer Part Number:

    LC5256MV-5FN256C

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    BGA

  • Package Description:

    FBGA-256

  • Pin Count:

    256

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Lattice Semiconductor Corporation

  • YTEOL:

    0

  • Additional Feature:

    YES

  • In-System Programmable:

    YES

  • JESD-30 Code:

    S-PBGA-B256

  • JESD-609 Code:

    e1

  • JTAG BST:

    YES

  • Length:

    17 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    141

  • Number of Macro Cells:

    256

  • Number of Terminals:

    256

  • Organization:

    0 DEDICATED INPUTS, 141 I/O

  • Output Function:

    MACROCELL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA256,16X16,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    250

  • Programmable Logic Type:

    EE PLD

  • Propagation Delay:

    6 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.1 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    17 mm

LC5256MV-5FN256C Frequently Asked Questions (FAQs)

  • The recommended power-up sequence is to apply VCCIO first, followed by VCC, and then VCCAUX. This ensures that the internal voltage regulators are powered up correctly.
  • To implement a reliable JTAG chain, ensure that each device has a unique TDI/TDO pin connection, and use a JTAG cable with a 1-kΩ pull-up resistor on the TCK line. Also, use a JTAG adapter or a buffer chip to reduce signal loading and improve signal integrity.
  • The maximum operating frequency of the LC5256MV-5FN256C is 150 MHz, but this can vary depending on the specific application, operating conditions, and device utilization. It's recommended to consult the datasheet and perform timing analysis to determine the maximum frequency for a specific design.
  • To optimize the LC5256MV-5FN256C for low power consumption, use the following techniques: reduce clock frequency, use clock gating, minimize switching activity, use low-power modes (e.g., sleep mode), and optimize the design for low-power operation using the Lattice Diamond software.
  • The recommended PCB layout and routing strategy for the LC5256MV-5FN256C involves using a 4-layer PCB with a solid ground plane, placing decoupling capacitors close to the device, and using controlled impedance routing for high-speed signals. It's also recommended to follow the Lattice Semiconductor Corporation's PCB design guidelines and consult with a PCB design expert.

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LC5256MV-5FN256C Overview

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Part Image LC5256MV-5F256C Lattice Semiconductor Corporation

EE PLD, 6ns, 256-Cell, CMOS, PBGA256