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LC5512MV-75Q208C - Lattice Semiconductor

Description: IC CPLD 512MC 7.5NS 208QFP

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LC5512MV-75Q208C - Lattice Semiconductor PCB footprint - Quad Flat Packages - Quad Flat Packages - 208-Pin PQFP
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3D Models
LC5512MV-75Q208C - Lattice Semiconductor  - 3D model - Quad Flat Packages - 208-Pin PQFP
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LC5512MV-75Q208C Details

  • Manufacturer Part Number:

    LC5512MV-75Q208C

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QFP

  • Package Description:

    QFP-208

  • Pin Count:

    208

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Lattice Semiconductor Corporation

  • YTEOL:

    0

  • Additional Feature:

    YES

  • In-System Programmable:

    YES

  • JESD-30 Code:

    S-PQFP-G208

  • JESD-609 Code:

    e0

  • JTAG BST:

    YES

  • Length:

    28 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    149

  • Number of Macro Cells:

    512

  • Number of Terminals:

    208

  • Organization:

    0 DEDICATED INPUTS, 149 I/O

  • Output Function:

    MACROCELL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FQFP

  • Package Equivalence Code:

    QFP208,1.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, FINE PITCH

  • Peak Reflow Temperature (Cel):

    225

  • Programmable Logic Type:

    EE PLD

  • Propagation Delay:

    9.5 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    4.1 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Lead (Sn85Pb15)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    28 mm

LC5512MV-75Q208C Frequently Asked Questions (FAQs)

  • Lattice provides a PCB layout guide and reference design files for the LC5512MV-75Q208C, which can be found on their website. It's recommended to follow these guidelines to ensure optimal performance and minimize signal integrity issues.
  • The LC5512MV-75Q208C has an internal POR and BOD circuitry. However, external circuitry may be required to ensure reliable operation. Lattice provides application notes and design guides that outline the recommended implementation for POR and BOD.
  • The LC5512MV-75Q208C has a thermal junction-to-case rating of 30°C/W. It's essential to ensure proper thermal management by using a heat sink, thermal interface material, and following Lattice's thermal management guidelines to prevent overheating and ensure reliable operation.
  • The LC5512MV-75Q208C has a complex clocking architecture. Lattice provides a Clocking and PLL User Guide that outlines the recommended configuration and settings for the device. Additionally, the Lattice Diamond software provides a clocking wizard to simplify the configuration process.
  • The LC5512MV-75Q208C has multiple I/O banks that can be configured for different voltage levels. Lattice provides a I/O Bank and Voltage Level User Guide that outlines the recommended settings and configuration options for the device.

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LC5512MV-75Q208C Overview

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Part Image LC5512MV-75QN208C Lattice Semiconductor Corporation

EE PLD, 9.5ns, 512-Cell, CMOS, PQFP208