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LC78615E-01US-H - onsemi

Description: RF signal processing for CD-DA/R/RW, servo control and EFM signal processing; Outputs CDDA, CDROM data; Outputs CD-TEXT decoded data using the serial interface or Serial communication line with external main controller; CD playback system is realized with simple macro commands by the external controller because of the internal Sequencer (8-bit CPU); Operating Voltage : 3.3V (typ); Operating Temperature : -40°C to +85°C

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LC78615E-01US-H - onsemi PCB footprint - Quad Flat Packages - Quad Flat Packages - PQFP64 14*14/qip64e case122bp issue A
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LC78615E-01US-H - onsemi  - 3D model - Quad Flat Packages - PQFP64 14*14/qip64e case122bp issue A
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LC78615E-01US-H Details

  • Manufacturer Part Number:

    LC78615E-01US-H

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    PQFP-64 / QIP-64E

  • Manufacturer Package Code:

    122BP

  • Country Of Origin:

    Philippines

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Consumer IC Type:

    CONSUMER CIRCUIT

  • JESD-30 Code:

    S-PQFP-G64

  • JESD-609 Code:

    e6

  • Length:

    14 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    64

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QFP

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    3 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    TIN BISMUTH

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    14 mm

LC78615E-01US-H Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the exposed pad to the ground plane. This helps to dissipate heat efficiently.
  • To ensure reliable operation across the entire operating temperature range, it's essential to follow the recommended operating conditions, including voltage, current, and power dissipation. Additionally, consider using thermal management techniques, such as heat sinks or thermal interfaces, to maintain a safe junction temperature.
  • The critical timing parameters for the LC78615E-01US-H include the clock frequency, setup and hold times, and propagation delay. To ensure these parameters are met, carefully review the datasheet and application notes, and use simulation tools or SPICE models to verify the design.
  • To handle ESD protection for the LC78615E-01US-H, follow the recommended ESD handling procedures, such as using an ESD wrist strap or mat, and storing the devices in anti-static packaging. Additionally, consider using ESD protection devices, such as TVS diodes, in the circuit design.
  • The recommended power sequencing and voltage ramp-up procedures for the LC78615E-01US-H involve slowly ramping up the power supply voltage to the recommended operating voltage, while ensuring that the input voltage is stable and within the recommended range.

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LC78615E-01US-H Overview

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