3.94 X 2.44 MM, 0.65 MM HEIGHT, HALOGEN AND LEAD FREE, WLCSP-40
Manufacturer Package Code:
567JB
Country Of Origin:
Philippines
Manufacturer:
onsemi
YTEOL:
0
Interface IC Type:
INTERFACE CIRCUIT
JESD-30 Code:
R-PBGA-B40
JESD-609 Code:
e1
Length:
3.94 mm
Moisture Sensitivity Level:
1
Number of Functions:
1
Number of Terminals:
40
Package Body Material:
PLASTIC/EPOXY
Package Code:
VFBGA
Package Shape:
RECTANGULAR
Package Style:
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel):
260
Seated Height-Max:
0.65 mm
Supply Voltage-Max:
3.6 V
Supply Voltage-Min:
2.6 V
Supply Voltage-Nom:
3 V
Supply Voltage1-Max:
5.5 V
Supply Voltage1-Min:
2.6 V
Surface Mount:
YES
Technology:
CMOS
Terminal Finish:
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form:
BALL
Terminal Pitch:
0.5 mm
Terminal Position:
BOTTOM
Time@Peak Reflow Temperature-Max (s):
30
Width:
2.44 mm
LC898121XA-MH Frequently Asked Questions (FAQs)
A good PCB layout for the LC898121XA-MH should consider the following: keep the input and output capacitors close to the IC, use a solid ground plane, and minimize the length of the traces between the IC and the capacitors. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
To ensure the stability of the output voltage, make sure to use the recommended output capacitor value and type (e.g., ceramic or tantalum). Also, ensure that the output capacitor is placed close to the IC and that the PCB layout is well-designed to minimize noise and oscillations.
The maximum allowed input voltage ripple for the LC898121XA-MH is not explicitly stated in the datasheet. However, as a general rule, it's recommended to keep the input voltage ripple below 10% of the nominal input voltage to ensure stable operation.
While it's possible to use a different inductor value, it's not recommended. The recommended inductor value is carefully selected to ensure optimal performance and stability. Using a different value may affect the converter's efficiency, stability, and output voltage regulation.
To handle thermal management for the LC898121XA-MH, ensure good airflow around the IC, and consider using a heat sink or a thermal pad to dissipate heat. The IC's thermal pad should be connected to a solid ground plane to improve heat dissipation.
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LC898121XA-MH Overview
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