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LCMXO2-1200HC-4TG100CR1 - Lattice Semiconductor

Description: IC FPGA 79 I/O 100TQFP

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LCMXO2-1200HC-4TG100CR1 - Lattice Semiconductor PCB footprint - Quad Flat Packages - Quad Flat Packages - 100-Pin TQFP
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LCMXO2-1200HC-4TG100CR1 - Lattice Semiconductor  - 3D model - Quad Flat Packages - 100-Pin TQFP
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LCMXO2-1200HC-4TG100CR1 Details

  • Manufacturer Part Number:

    LCMXO2-1200HC-4TG100CR1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QFP

  • Pin Count:

    100

  • HTS Code:

    8542.31.00.60

  • Manufacturer:

    Lattice Semiconductor Corporation

  • YTEOL:

    0

  • Clock Frequency-Max:

    133 MHz

  • JESD-30 Code:

    S-PQFP-G100

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    3

  • Number of Inputs:

    80

  • Number of Logic Cells:

    1280

  • Number of Outputs:

    80

  • Number of Terminals:

    100

  • Operating Temperature-Max:

    85 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QFP

  • Package Equivalence Code:

    QFP100,.63SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Supply Voltage-Max:

    3.465 V

  • Supply Voltage-Min:

    2.375 V

  • Supply Voltage-Nom:

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

LCMXO2-1200HC-4TG100CR1 Frequently Asked Questions (FAQs)

  • Lattice Semiconductor provides a PCB layout guide for the LCMXO2-1200HC-4TG100CR1, which recommends a 4-layer PCB with a solid ground plane, and specific routing guidelines for clock and signal traces to minimize noise and crosstalk.
  • A POR circuit can be implemented using an external resistor and capacitor connected to the VCC pin, with a recommended value of 1 kΩ and 10 μF, respectively. This ensures a reliable reset signal during power-up.
  • The LCMXO2-1200HC-4TG100CR1 has a thermal junction-to-ambient resistance of 24°C/W. To manage thermal performance, ensure good airflow, use a heat sink if necessary, and follow Lattice's thermal design guidelines.
  • To minimize power consumption, use the device's built-in power management features, such as clock gating and dynamic voltage frequency scaling. Additionally, optimize the design to minimize switching activity, use low-power modes, and consider using a lower voltage supply.
  • To ensure high-speed signal integrity, follow Lattice's signal integrity guidelines, which include using differential signaling, controlling impedance, and minimizing signal reflections. Also, use IBIS models and simulation tools to validate the design.

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LCMXO2-1200HC-4TG100CR1 Overview

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Part Image LCMXO2-1200HC-4TG100I Lattice Semiconductor Corporation

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Part Image LCMXO2-1200HC-4TG100IR1 Lattice Semiconductor Corporation

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