LCMXO2-2000HE-4BG256I footprint, schematic symbol and 3D model by Lattice Semiconductor

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LCMXO2-2000HE-4BG256I - Lattice Semiconductor PCB footprint - BGA - BGA - 256-Ball caBGA

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LCMXO2-2000HE-4BG256I - Lattice Semiconductor - 3D model - BGA - 256-Ball caBGA

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Datasheet Download Datasheet
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Part Number LCMXO2-2000HE-4BG256I
Manufacturer Lattice Semiconductor
Pin Count 256
Part Category Integrated Circuit
Package Category BGA
Footprint Name BGA - 256-Ball caBGA
Released Date Mar 17, 2022
Last Modified Date Mar 7, 2023 4:10 PM UTC
Pinout / Pin List Click Here (Member Only)

LCMXO2-2000HE-4BG256I Details

Manufacturer Part Number:
LCMXO2-2000HE-4BG256I
Pbfree Code:
Yes
Rohs Code:
Yes
Part Life Cycle Code:
Active
Country Of Origin:
Malaysia, Philippines, Taiwan
ECCN Code:
3A991.D
HTS Code:
8542.39.00.01
Manufacturer:
Lattice Semiconductor Corporation
YTEOL:
19
Clock Frequency-Max:
130.5 MHz
JESD-30 Code:
S-PBGA-B256
JESD-609 Code:
e1
Length:
14 mm
Moisture Sensitivity Level:
3
Number of Inputs:
206
Number of Logic Cells:
2112
Number of Outputs:
206
Number of Terminals:
256
Operating Temperature-Max:
100 °C
Operating Temperature-Min:
-40 °C
Organization:
264 CLBS
Package Body Material:
PLASTIC/EPOXY
Package Code:
LFBGA
Package Equivalence Code:
BGA256,16X16,32
Package Shape:
SQUARE
Package Style:
GRID ARRAY, LOW PROFILE, FINE PITCH
Packing Method:
TRAY
Peak Reflow Temperature (Cel):
260
Programmable Logic Type:
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status:
Not Qualified
Seated Height-Max:
1.7 mm
Supply Voltage-Max:
1.26 V
Supply Voltage-Min:
1.14 V
Supply Voltage-Nom:
1.2 V
Surface Mount:
YES
Terminal Finish:
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form:
BALL
Terminal Pitch:
0.8 mm
Terminal Position:
BOTTOM
Time@Peak Reflow Temperature-Max (s):
30
Width:
14 mm

LCMXO2-2000HE-4BG256I Frequently Asked Questions (FAQs)

The maximum operating frequency of the LCMXO2-2000HE-4BG256I is 500 MHz.
To implement a CDC in the LCMXO2-2000HE-4BG256I, use the built-in clock domain crossing (CDC) circuitry and follow the guidelines provided in the Lattice Semiconductor Corporation's documentation and application notes.
The power consumption of the LCMXO2-2000HE-4BG256I depends on the operating frequency, voltage, and other factors. Refer to the datasheet for typical power consumption values and use the Lattice Semiconductor Corporation's power estimation tool for more accurate estimates.
No, the LCMXO2-2000HE-4BG256I is not a radiation-hardened device. If you need a radiation-hardened FPGA, consider using a different device from Lattice Semiconductor Corporation or other manufacturers that are specifically designed for radiation-hardened applications.
To implement a DDR3 memory interface in the LCMXO2-2000HE-4BG256I, use the built-in DDR3 memory controller and follow the guidelines provided in the Lattice Semiconductor Corporation's documentation and application notes.

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