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LCMXO2-4000HC-4FG484IAK7 - Lattice Semiconductor

Description: LCMXO2-4000HC-4FG484IAK7

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PCB Footprints
LCMXO2-4000HC-4FG484IAK7 - Lattice Semiconductor PCB footprint - BGA - BGA - FG484
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3D Models
LCMXO2-4000HC-4FG484IAK7 - Lattice Semiconductor  - 3D model - BGA - FG484
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LCMXO2-4000HC-4FG484IAK7 Details

  • Manufacturer Part Number:

    LCMXO2-4000HC-4FG484IAK7

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FPBGA-484

  • HTS Code:

    8542.31.00.60

  • Manufacturer:

    Lattice Semiconductor Corporation

  • YTEOL:

    19

  • Additional Feature:

    ALSO OPERATES AT 3.3 V NOMINAL SUPPLY

  • JESD-30 Code:

    S-PBGA-B484

  • JESD-609 Code:

    e1

  • Length:

    23 mm

  • Moisture Sensitivity Level:

    3

  • Number of Inputs:

    278

  • Number of Logic Cells:

    4320

  • Number of Outputs:

    278

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA484,22X22,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Packing Method:

    TRAY

  • Peak Reflow Temperature (Cel):

    250

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    2.6 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    2.375 V

  • Supply Voltage-Nom:

    2.5 V

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN SILVER COPPER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    23 mm

LCMXO2-4000HC-4FG484IAK7 Frequently Asked Questions (FAQs)

  • Lattice provides a PCB layout and routing guide for the LCMXO2-4000HC-4FG484IAK7 in their documentation. It's recommended to follow the guidelines for signal integrity, power distribution, and thermal management to ensure optimal performance and reliability.
  • Lattice recommends using an external POR circuit with a voltage supervisor IC, such as the TLV7031, to ensure a reliable power-on reset. The POR circuit should be designed to meet the FPGA's power-up sequencing requirements and voltage thresholds.
  • The LCMXO2-4000HC-4FG484IAK7 has a thermal design power (TDP) of 1.5W. To manage thermal performance, it's recommended to use a heat sink, ensure good airflow, and follow Lattice's thermal management guidelines for PCB design and layout.
  • To optimize power consumption, use Lattice's Power Calculator tool to estimate power consumption based on your design requirements. Implement power-saving techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling (DVFS) in your design.
  • The internal oscillator frequency and settings depend on the specific application requirements. Lattice recommends using the internal oscillator with a frequency of 12 MHz or 24 MHz, and configuring the oscillator settings using the Lattice Diamond software or the FPGA's configuration registers.

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LCMXO2-4000HC-4FG484IAK7 Overview

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