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LCMXO2-7000HC-6FG484C - Lattice Semiconductor

Description: FPGA - 现场可编程门阵列 6864 LUTs 335 I/O 3.3V 6 SPEED

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LCMXO2-7000HC-6FG484C - Lattice Semiconductor PCB footprint - BGA - BGA - FG484
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LCMXO2-7000HC-6FG484C - Lattice Semiconductor  - 3D model - BGA - FG484
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LCMXO2-7000HC-6FG484C Details

  • Manufacturer Part Number:

    LCMXO2-7000HC-6FG484C

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Malaysia, Philippines, Taiwan

  • ECCN Code:

    3A991.D

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Lattice Semiconductor Corporation

  • YTEOL:

    19

  • Additional Feature:

    ALSO OPERATES AT 3.3 V NOMINAL SUPPLY

  • Clock Frequency-Max:

    128.7 MHz

  • JESD-30 Code:

    S-PBGA-B484

  • JESD-609 Code:

    e1

  • Length:

    23 mm

  • Moisture Sensitivity Level:

    3

  • Number of Inputs:

    334

  • Number of Logic Cells:

    6864

  • Number of Outputs:

    334

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    85 °C

  • Organization:

    858 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HBGA

  • Package Equivalence Code:

    BGA484,22X22,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, HEAT SINK/SLUG

  • Packing Method:

    TRAY

  • Peak Reflow Temperature (Cel):

    250

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.6 mm

  • Supply Voltage-Max:

    3.465 V

  • Supply Voltage-Min:

    2.375 V

  • Supply Voltage-Nom:

    2.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    23 mm

LCMXO2-7000HC-6FG484C Frequently Asked Questions (FAQs)

  • Lattice provides a PCB layout and routing guide for the LCMXO2-7000HC-6FG484C in their documentation. It's recommended to follow the guidelines for signal integrity, power distribution, and thermal management to ensure optimal performance and reliability.
  • Lattice recommends using an external POR circuit with a voltage supervisor IC, such as the TLV7031, to ensure a reliable power-on reset. The POR circuit should be designed to meet the FPGA's power-up sequencing requirements and voltage thresholds.
  • The LCMXO2-7000HC-6FG484C has a thermal design power (TDP) of 1.5W. To manage thermal performance, it's recommended to use a heat sink, thermal interface material, and ensure good airflow around the device. Lattice provides thermal modeling and simulation tools to help with thermal design.
  • To optimize power consumption, use Lattice's Power Calculator tool to estimate power consumption based on your design's requirements. Implement power-saving techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling (DVFS) in your design.
  • The LCMXO2-7000HC-6FG484C has built-in security features such as AES encryption, secure boot, and bitstream encryption. Additionally, Lattice provides a Secure Enclave IP core for secure key storage and management.

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LCMXO2-7000HC-6FG484C Overview

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