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LCMXO2-7000HE-5FG484C - Lattice Semiconductor

Description: FPGA - Field Programmable Gate Array 6864 LUTs 335 I/O 1.2V 5 SPEED

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LCMXO2-7000HE-5FG484C - Lattice Semiconductor PCB footprint - BGA - BGA - 484-Ball fpBGA
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LCMXO2-7000HE-5FG484C - Lattice Semiconductor  - 3D model - BGA - 484-Ball fpBGA
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LCMXO2-7000HE-5FG484C Details

  • Manufacturer Part Number:

    LCMXO2-7000HE-5FG484C

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Malaysia, Philippines, Taiwan

  • ECCN Code:

    3A991.D

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Lattice Semiconductor Corporation

  • YTEOL:

    19

  • Clock Frequency-Max:

    128.7 MHz

  • JESD-30 Code:

    S-PBGA-B484

  • JESD-609 Code:

    e1

  • Length:

    23 mm

  • Moisture Sensitivity Level:

    3

  • Number of Inputs:

    334

  • Number of Logic Cells:

    6864

  • Number of Outputs:

    334

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    85 °C

  • Organization:

    858 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HBGA

  • Package Equivalence Code:

    BGA484,22X22,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, HEAT SINK/SLUG

  • Packing Method:

    TRAY

  • Peak Reflow Temperature (Cel):

    250

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.6 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    23 mm

LCMXO2-7000HE-5FG484C Frequently Asked Questions (FAQs)

  • Lattice provides a PCB layout and routing guide for the LCMXO2-7000HE-5FG484C in their documentation. It's recommended to follow the guidelines for signal integrity, power distribution, and thermal management to ensure optimal performance and reliability.
  • Lattice recommends using an external POR circuit with a voltage supervisor IC, such as the TLV7031, to ensure a reliable power-on reset. The POR circuit should be designed to meet the FPGA's power-up sequencing requirements.
  • The LCMXO2-7000HE-5FG484C has a thermal design power (TDP) of 1.5W. To manage thermal performance, Lattice recommends using a heat sink, thermal interface material, and ensuring good airflow around the device. The FPGA's thermal management guidelines should be followed to prevent overheating and ensure reliability.
  • Lattice provides power estimation and optimization tools, such as the Power Calculator and the Lattice Diamond software, to help optimize power consumption for specific applications. Additionally, designers can use power-saving features like clock gating, dynamic voltage and frequency scaling, and low-power modes to reduce power consumption.
  • The LCMXO2-7000HE-5FG484C has built-in security features like AES encryption, secure boot, and bitstream encryption. Lattice provides documentation and software tools, such as the Lattice Diamond software, to help implement these security features and protect the FPGA's configuration and data.

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LCMXO2-7000HE-5FG484C Overview

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