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LCMXO2-7000ZE-1BG256I - Lattice Semiconductor

Description: LATTICE SEMICONDUCTOR - LCMXO2-7000ZE-1BG256I - PLD, 6864 LUTS, MACHXO2, 256CABGA

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LCMXO2-7000ZE-1BG256I - Lattice Semiconductor PCB footprint - BGA - BGA - 256-Ball caBGA Package
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LCMXO2-7000ZE-1BG256I - Lattice Semiconductor  - 3D model - BGA - 256-Ball caBGA Package
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LCMXO2-7000ZE-1BG256I Details

  • Manufacturer Part Number:

    LCMXO2-7000ZE-1BG256I

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Malaysia, Philippines, Taiwan

  • ECCN Code:

    3A991.D

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Lattice Semiconductor Corporation

  • YTEOL:

    19

  • Clock Frequency-Max:

    86.5 MHz

  • JESD-30 Code:

    S-PBGA-B256

  • JESD-609 Code:

    e1

  • Length:

    14 mm

  • Moisture Sensitivity Level:

    3

  • Number of Inputs:

    206

  • Number of Logic Cells:

    6864

  • Number of Outputs:

    206

  • Number of Terminals:

    256

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    858 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA256,16X16,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Packing Method:

    TRAY

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.7 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    14 mm

LCMXO2-7000ZE-1BG256I Frequently Asked Questions (FAQs)

  • The LCMXO2-7000ZE-1BG256I has an operating temperature range of -40°C to 100°C.
  • Lattice recommends using a synchronizer or a FIFO to implement CDC in the LCMXO2-7000ZE-1BG256I. The specific implementation depends on the clock frequencies and data transfer requirements.
  • The power consumption of the LCMXO2-7000ZE-1BG256I depends on the device utilization, clock frequency, and operating voltage. According to the datasheet, the typical power consumption is around 1.2W at 1.2V and 100MHz.
  • Yes, the LCMXO2-7000ZE-1BG256I supports high-speed interfaces like PCIe and SATA. However, the specific implementation and performance may vary depending on the design and requirements.
  • To optimize the design for area and power in the LCMXO2-7000ZE-1BG256I, use the Lattice Diamond design software to implement area and power optimization techniques such as resource sharing, clock gating, and voltage scaling.

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LCMXO2-7000ZE-1BG256I Overview

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