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LCS708HG - Power Integrations

Description: Gate Drivers 440W HV CONTROLLER MOSFET

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LCS708HG - Power Integrations PCB footprint - Other - Other - H Package (eSIP-16J)
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LCS708HG - Power Integrations  - 3D model - Other - H Package (eSIP-16J)
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LCS708HG Details

  • Manufacturer Part Number:

    LCS708HG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SIP

  • Pin Count:

    16/13

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Power Integrations

  • YTEOL:

    0

  • High Side Driver:

    YES

  • Interface IC Type:

    HALF BRIDGE BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PZIP-T13

  • JESD-609 Code:

    e3

  • Length:

    16.51 mm

  • Number of Functions:

    1

  • Number of Terminals:

    13

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SZIP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Supply Voltage-Max:

    15 V

  • Supply Voltage-Min:

    11.4 V

  • Supply Voltage-Nom:

    12 V

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    0.97 mm

  • Terminal Position:

    ZIG-ZAG

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    2.01 mm

LCS708HG Frequently Asked Questions (FAQs)

  • The LCS708HG can operate safely between -40°C to 125°C, but the recommended operating temperature range is -20°C to 85°C for optimal performance.
  • The LCS708HG requires a bias voltage of 12V to 15V on the VCC pin, and a minimum of 10uF capacitance on the VCC pin to ensure stable operation.
  • The LCS708HG can deliver up to 700mA of output current, but it's recommended to derate the output current to 500mA for optimal reliability and thermal performance.
  • The LCS708HG has built-in overvoltage protection (OVP) and overcurrent protection (OCP), but it's recommended to add external protection components such as TVS diodes and fuses to ensure robust protection.
  • A multi-layer PCB with a solid ground plane and a thermal pad connected to a heat sink is recommended for optimal thermal performance. A minimum of 2oz copper thickness is recommended for the PCB.

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