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LD39015M08R - STMicroelectronics

Description: 150 mA low quiescent current and low noise voltage regulator

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PCB Footprints
LD39015M08R - STMicroelectronics PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - SOT23-5L-ren1
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LD39015M08R - STMicroelectronics  - 3D model - SOT23 (5-Pin) - SOT23-5L-ren1
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LD39015M08R Details

  • Manufacturer Part Number:

    LD39015M08R

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Package Description:

    ROHS COMPLIANT, SOT-23, 5 PIN

  • Pin Count:

    5

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    7

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.1 V

  • Dropout Voltage1-Nom:

    0.08 V

  • Input Voltage Absolute-Max:

    7 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    1.5 V

  • JESD-30 Code:

    R-PDSO-G5

  • Length:

    2.9 mm

  • Line Regulation-Max:

    0.00032%

  • Load Regulation-Max:

    0.002384%

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    5

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.15 A

  • Output Voltage1-Max:

    0.824 V

  • Output Voltage1-Min:

    0.776 V

  • Output Voltage1-Nom:

    0.8 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    1.45 mm

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Voltage Tolerance-Max:

    3.75%

  • Width:

    1.625 mm

LD39015M08R Frequently Asked Questions (FAQs)

  • STMicroelectronics provides a recommended PCB layout in the application note AN5176, which includes guidelines for thermal vias, copper pours, and component placement to minimize thermal resistance and ensure reliable operation.
  • Follow the recommended soldering profile in the datasheet, and ensure the PCB is designed with a sufficient thermal relief pattern to prevent thermal damage. Additionally, use a solder paste with a high melting point and a reflow oven with a controlled temperature profile.
  • The maximum allowed voltage on the EN pin is VCC + 0.3V. It should be driven with a logic signal from a microcontroller or other digital source, with a pull-up resistor to VCC and a pull-down resistor to GND to ensure proper operation.
  • Use the equations provided in the datasheet to calculate the output voltage ripple and noise based on the input voltage, output voltage, and output current. Additionally, consider the PCB layout, component selection, and filtering components to minimize noise and ripple.
  • STMicroelectronics recommends using X7R or X5R ceramic capacitors with a voltage rating of at least 2x the input voltage for the input capacitor, and a voltage rating of at least 2x the output voltage for the output capacitor. The capacitance value should be selected based on the specific application requirements and the datasheet recommendations.

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LD39015M08R Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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