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LDLN015PU25R - STMicroelectronics

Description: 150 mA - ultra low noise - high PSRR linear voltage regulator IC

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PCB Footprints
LDLN015PU25R - STMicroelectronics PCB footprint - Other - Other - DFN6 (2 x 2 mm)
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3D Models
LDLN015PU25R - STMicroelectronics  - 3D model - Other - DFN6 (2 x 2 mm)
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LDLN015PU25R Details

  • Manufacturer Part Number:

    LDLN015PU25R

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    DFN-6

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.18 V

  • Dropout Voltage1-Nom:

    0.086 V

  • Input Voltage Absolute-Max:

    7 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    3.5 V

  • JESD-30 Code:

    S-PDSO-N6

  • Length:

    2 mm

  • Line Regulation-Max:

    0.00025%

  • Load Regulation-Max:

    0.003725%

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    6

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.15 A

  • Output Voltage1-Max:

    2.55 V

  • Output Voltage1-Min:

    2.45 V

  • Output Voltage1-Nom:

    2.5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC6,.08,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    0.6 mm

  • Surface Mount:

    YES

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Voltage Tolerance-Max:

    2%

  • Width:

    2 mm

LDLN015PU25R Frequently Asked Questions (FAQs)

  • STMicroelectronics provides a recommended PCB layout in their application note AN2663, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • The LDLN015PU25R has a thermal pad that must be connected to a thermal ground plane on the PCB to dissipate heat efficiently. A thermal interface material (TIM) can be used to improve thermal conductivity. Additionally, ensure good airflow around the device and avoid blocking the thermal pad with other components or obstacles.
  • Although the datasheet specifies a maximum input voltage of 25V, it's essential to note that the absolute maximum rating is 30V. However, operating the device at this voltage may reduce its lifespan. It's recommended to keep the input voltage below 25V to ensure reliable operation and minimize the risk of damage.
  • The LDLN015PU25R is rated for operation up to 150°C, but its performance and reliability may degrade at higher temperatures. If your application requires operation above 125°C, consult with STMicroelectronics or a qualified engineer to ensure the device can meet your specific requirements.
  • Start by verifying the input voltage, current, and temperature are within the recommended specifications. Check the PCB layout and routing for any potential issues, such as electromagnetic interference (EMI) or thermal management problems. Consult the datasheet and application notes for troubleshooting guidelines, and consider contacting STMicroelectronics' technical support for further assistance.

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LDLN015PU25R Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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