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LDLN025J12R - STMicroelectronics

Description: LDO Voltage Regulators POWER MANAGEMENT

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LDLN025J12R - STMicroelectronics - PCB symbol
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LDLN025J12R - STMicroelectronics PCB footprint - BGA - BGA - Flip-Chip4
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LDLN025J12R - STMicroelectronics - 3D model - BGA - Flip-Chip4
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LDLN025J12R Details

  • Manufacturer Part Number:

    LDLN025J12R

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    Flip-chip-4

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2016-11-17

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.2 V

  • Dropout Voltage1-Nom:

    0.12 V

  • Input Voltage Absolute-Max:

    7 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    1.5 V

  • JESD-30 Code:

    S-PBGA-B4

  • Length:

    0.628 mm

  • Line Regulation-Max:

    0.00288%

  • Load Regulation-Max:

    0.02%

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    4

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.25 A

  • Output Voltage1-Max:

    1.236 V

  • Output Voltage1-Min:

    1.164 V

  • Output Voltage1-Nom:

    1.2 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    0.445 mm

  • Surface Mount:

    YES

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.35 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Voltage Tolerance-Max:

    3%

  • Width:

    0.628 mm

LDLN025J12R Frequently Asked Questions (FAQs)

  • STMicroelectronics provides a recommended PCB layout in their application note AN2663, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • Follow the recommended soldering profile and thermal management guidelines provided in the datasheet and application notes. Ensure the PCB is designed with adequate thermal vias and heat sinks to dissipate heat during reflow. Use a soldering iron with a temperature-controlled tip and avoid applying excessive force or pressure during soldering.
  • The LDLN025J12R is rated for operation from -40°C to 150°C (junction temperature). However, the device's performance and reliability may degrade at temperatures above 125°C. It's essential to ensure proper thermal management and heat sinking to maintain a safe operating temperature.
  • The LDLN025J12R is designed to withstand moderate levels of vibration and shock. However, it's essential to ensure the device is properly mounted and secured to the PCB using recommended soldering and assembly techniques. Additionally, consider using vibration-dampening materials or potting compounds to reduce the risk of mechanical stress and damage.
  • Start by reviewing the datasheet and application notes to ensure proper design and implementation. Use oscilloscopes and logic analyzers to debug the circuit and identify potential issues. Check for proper power supply, signal integrity, and thermal management. If issues persist, consult with STMicroelectronics' technical support or a qualified engineer for further assistance.

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LDLN025J12R Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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