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LDLN025M12R - STMicroelectronics

Description: 250 mA ultra low noise LDO

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PCB Footprints
LDLN025M12R - STMicroelectronics PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - SOT23-5L-
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3D Models
LDLN025M12R - STMicroelectronics  - 3D model - SOT23 (5-Pin) - SOT23-5L-
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LDLN025M12R Details

  • Manufacturer Part Number:

    LDLN025M12R

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOT-23, 5 PIN

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    8 Weeks

  • Date Of Intro:

    2017-07-31

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    8

  • Adjustability:

    FIXED

  • Dropout Voltage1-Nom:

    0.12 V

  • Input Voltage Absolute-Max:

    7 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    1.5 V

  • JESD-30 Code:

    R-PDSO-G5

  • Length:

    2.95 mm

  • Line Regulation-Max:

    0.00288%

  • Load Regulation-Max:

    0.02%

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    5

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.25 A

  • Output Voltage1-Max:

    1.248 V

  • Output Voltage1-Min:

    1.152 V

  • Output Voltage1-Nom:

    1.2 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    1.45 mm

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Voltage Tolerance-Max:

    4%

  • Width:

    1.6 mm

LDLN025M12R Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, vias should be placed under the package to connect the thermal pad to the copper area.
  • Ensure that the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C. Also, consider the power dissipation and thermal resistance of the package when designing the system.
  • A ceramic capacitor with a value of 10uF to 22uF is recommended for input decoupling. The capacitor should be placed as close to the device as possible to minimize noise and ensure stable operation.
  • Yes, the LDLN025M12R is AEC-Q100 qualified, making it suitable for automotive and high-reliability applications. However, additional testing and validation may be required to ensure compliance with specific industry standards.
  • Check the input voltage, output load, and PCB layout for any issues. Verify that the device is operated within the recommended specifications. Use oscilloscopes and thermal imaging cameras to diagnose issues. Consult the datasheet and application notes for troubleshooting guidelines.

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LDLN025M12R Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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