LE25S161XBTAG - onsemi

LE25S161XBTAG Details

• Manufacturer Part Number:

  LE25S161XBTAG

• Brand Name:

  onsemi

• Pbfree Code:

  Yes

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Obsolete

• Part Package Code:

  WLCSP8 2.92x1.53x0.525

• Package Description:

  WLCSP-8

• Manufacturer Package Code:

  567YR

• ECCN Code:

  EAR99

• HTS Code:

  8542.32.00.51

• Manufacturer:

  onsemi

• YTEOL:

  0

• Clock Frequency-Max (fCLK):

  70 MHz

• Data Retention Time-Min:

  20

• Endurance:

  100000 Write/Erase Cycles

• JESD-30 Code:

  R-PBGA-B8

• Length:

  2.92 mm

• Memory Density:

  16777216 bit

• Memory IC Type:

  FLASH

• Memory Width:

  8

• Moisture Sensitivity Level:

  1

• Number of Functions:

  1

• Number of Terminals:

  8

• Number of Words:

  2097152 words

• Number of Words Code:

  2000000

• Operating Mode:

  SYNCHRONOUS

• Operating Temperature-Max:

  90 °C

• Operating Temperature-Min:

  -40 °C

• Organization:

  2MX8

• Output Characteristics:

  3-STATE

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  VFBGA

• Package Equivalence Code:

  BGA8,2X4,20

• Package Shape:

  RECTANGULAR

• Package Style:

  GRID ARRAY, VERY THIN PROFILE, FINE PITCH

• Parallel/Serial:

  SERIAL

• Peak Reflow Temperature (Cel):

  260

• Programming Voltage:

  1.8 V

• Seated Height-Max:

  0.525 mm

• Serial Bus Type:

  SPI

• Standby Current-Max:

  0.000012 A

• Supply Current-Max:

  0.0075 mA

• Supply Voltage-Max (Vsup):

  1.95 V

• Supply Voltage-Min (Vsup):

  1.65 V

• Supply Voltage-Nom (Vsup):

  1.8 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Terminal Finish:

  Tin/Silver/Copper (Sn/Ag/Cu)

• Terminal Form:

  BALL

• Terminal Pitch:

  0.5 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  30

• Type:

  NOR TYPE

• Width:

  1.53 mm

• Write Protection:

  HARDWARE/SOFTWARE