Part Image

LE25S81AMDTWG - onsemi

Description: LE25S81AMDTWG, Serial-SPI Flash Memory, 1024K x 8 bit 8Mbit, 1.65 → 1.95 V, 8-Pin, SOIC

Download LE25S81AMDTWG Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
LE25S81AMDTWG - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC_08,150MIL
click to zoom
3D Models
LE25S81AMDTWG - onsemi  - 3D model - Small Outline Packages - SOIC_08,150MIL
click to zoom

LE25S81AMDTWG Details

  • Manufacturer Part Number:

    LE25S81AMDTWG

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    0.150 INCH, HALOGEN AND LEAD FREE, MS-012, SOIC-8

  • Manufacturer Package Code:

    751BD

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Clock Frequency-Max (fCLK):

    70 MHz

  • Data Retention Time-Min:

    20

  • Endurance:

    100000 Write/Erase Cycles

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Memory Density:

    8388608 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Words:

    1048576 words

  • Number of Words Code:

    1000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    90 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    1MX8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Parallel/Serial:

    SERIAL

  • Peak Reflow Temperature (Cel):

    260

  • Programming Voltage:

    1.8 V

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Serial Bus Type:

    SPI

  • Standby Current-Max:

    0.000015 A

  • Supply Current-Max:

    0.0085 mA

  • Supply Voltage-Max (Vsup):

    2.4 V

  • Supply Voltage-Min (Vsup):

    1.65 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Type:

    NOR TYPE

  • Width:

    3.9 mm

  • Write Protection:

    HARDWARE/SOFTWARE

LE25S81AMDTWG Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout. Also, consider derating the device's power handling at high temperatures.
  • The SOA is typically defined by the device's voltage, current, and power ratings. For the LE25S81AMDTWG, the SOA is limited by the maximum voltage (25V), current (8A), and power (100W) ratings.
  • Use ESD-safe handling and storage procedures, and consider adding ESD protection devices (e.g., TVS diodes) to the PCB design.
  • Follow the recommended soldering profile: peak temperature 260°C, time above 217°C 60s, and time above 183°C 150s.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

LE25S81AMDTWG Overview

Use the download button to access the LE25S81AMDTWG schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like LE25S, or try a keyword search, such as Flash Memories

Parts related to LE25S81AMDTWG

Showing 0 results