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LE25U40CMC-AH - onsemi

Description: Read/write operations enabled by single 2.5v power supply: 2.3 to 3.6V supply voltage range; Operating frequency : 40MHz; Temperature range : -40 to 85°C; Serial interface : SPI mode 0, mode 3 supported / Dual Output, Dual I/O supported; Sector size : 4K bytes/small sector, 64K bytes/sector; Small sector erase, sector erase, chip erase functions; Page program function (256 bytes / page); Block protect function; Highly reliable read/write; Status functions : Ready/busy information, protect information; Data

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LE25U40CMC-AH - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC−8 / SOP8J (200 mil) CASE 751CU ISSUE O
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LE25U40CMC-AH - onsemi  - 3D model - Small Outline Packages - SOIC−8 / SOP8J (200 mil) CASE 751CU ISSUE O
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LE25U40CMC-AH Details

  • Manufacturer Part Number:

    LE25U40CMC-AH

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC-8 / SOP8J (200 mil)

  • Package Description:

    SOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    751CU

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    39 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5

  • Clock Frequency-Max (fCLK):

    40 MHz

  • Data Retention Time-Min:

    20

  • Endurance:

    100000 Write/Erase Cycles

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Memory Density:

    4194304 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Words:

    524288 words

  • Number of Words Code:

    512000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    512KX8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Parallel/Serial:

    SERIAL

  • Peak Reflow Temperature (Cel):

    260

  • Programming Voltage:

    2.7 V

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Serial Bus Type:

    SPI

  • Standby Current-Max:

    0.00001 A

  • Supply Current-Max:

    0.015 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.3 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Type:

    NOR TYPE

  • Width:

    3.9 mm

  • Write Protection:

    HARDWARE/SOFTWARE

LE25U40CMC-AH Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a thermal relief pattern and a solid ground plane is recommended. The device should be placed near a thermal pad or a heat sink to ensure good heat dissipation.
  • Ensure that the device is operated within the recommended temperature range (TJ = -40°C to 150°C). Use a heat sink or thermal pad to maintain a low junction temperature. Avoid overheating, which can cause permanent damage.
  • The maximum allowed voltage on the input pins is 5.5V. Exceeding this voltage may cause permanent damage to the device.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input pins to protect against electrostatic discharge. Follow proper handling and storage procedures to prevent ESD damage.
  • Use a soldering profile with a peak temperature of 260°C and a dwell time of 10-30 seconds. Avoid exceeding the recommended temperature and time to prevent damage to the device.

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