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LF2190NTR - LITTELFUSE

Description: High Side and Low Side Drivers Series

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Symbol
LF2190NTR - LITTELFUSE - PCB symbol
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PCB Footprints
LF2190NTR - LITTELFUSE PCB footprint - Small Outline Packages - Small Outline Packages - SOIC(N)-8
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3D Models
LF2190NTR - LITTELFUSE - 3D model - Small Outline Packages - SOIC(N)-8
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LF2190NTR Details

  • Manufacturer Part Number:

    LF2190NTR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    8.4

  • High Side Driver:

    YES

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    HALF BRIDGE BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    PUSH-PULL

  • Output Peak Current Limit-Nom:

    4.5 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    20 V

  • Supply Voltage-Min:

    10 V

  • Supply Voltage-Nom:

    15 V

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.2 µs

  • Turn-on Time:

    0.2 µs

  • Width:

    3.9 mm

LF2190NTR Frequently Asked Questions (FAQs)

  • Littelfuse recommends a thermal pad with a minimum size of 2.5mm x 2.5mm, with multiple vias to the ground plane to ensure efficient heat dissipation. A larger thermal pad and more vias can further improve thermal performance.
  • Yes, the LF2190NTR is qualified to AEC-Q101 standards, making it suitable for automotive and high-reliability applications. However, it's essential to review the device's qualification data and ensure it meets the specific requirements of your application.
  • Littelfuse recommends following the recommended soldering profile, which includes a peak temperature of 260°C (500°F) for 10-30 seconds. Ensure the PCB is designed with a solder mask and a sufficient solder land pattern to prevent solder bridging and ensure reliable connections.
  • The LF2190NTR is sensitive to electrostatic discharge (ESD) and voltage stress. Littelfuse recommends handling the device with ESD protection and limiting voltage stress to 10V or less during assembly and handling to prevent damage.
  • Yes, the LF2190NTR can be used in parallel configurations to increase current handling. However, it's essential to ensure that the devices are properly matched, and the PCB is designed to minimize current imbalance and thermal mismatch between devices.

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LF2190NTR Overview

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