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LFC789D25CDR - Texas Instruments

Description: Dual Linear FET Controller

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LFC789D25CDR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D0008A
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LFC789D25CDR - Texas Instruments  - 3D model - Small Outline Packages - D0008A
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LFC789D25CDR Details

  • Manufacturer Part Number:

    LFC789D25CDR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Country Of Origin:

    Mexico

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • Input Voltage-Max:

    16 V

  • Input Voltage-Min:

    9 V

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    70 °C

  • Output Current-Max:

    3 A

  • Output Voltage-Max:

    2.5 V

  • Output Voltage-Min:

    2.5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max (Vsup):

    16 V

  • Supply Voltage-Min (Vsup):

    9 V

  • Supply Voltage-Nom (Vsup):

    12 V

  • Surface Mount:

    YES

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Trim/Adjustable Output:

    NO

  • Width:

    3.9 mm

LFC789D25CDR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's essential to follow good layout practices, such as keeping the input and output traces separate, using a solid ground plane, and minimizing parasitic inductance. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure the device operates within the specified temperature range, it's crucial to provide adequate heat sinking, especially in high-power applications. The device's thermal pad should be connected to a solid ground plane, and a thermal interface material (TIM) can be used to improve heat transfer. Additionally, the device should be operated within the recommended ambient temperature range of -40°C to 85°C.
  • The maximum input voltage that can be applied to the LFC789D25CDR is 5.5V. Exceeding this voltage can cause permanent damage to the device. It's essential to ensure that the input voltage is within the recommended range of 3.3V to 5.5V to maintain device reliability and performance.
  • To troubleshoot issues with the device's output voltage regulation, start by verifying the input voltage and ensuring it's within the recommended range. Check the output voltage using a multimeter and ensure it's within the specified tolerance. If the output voltage is not regulated, check the feedback resistors and capacitors for any signs of damage or incorrect values. Also, verify that the device is properly soldered and that there are no signs of overheating.
  • The LFC789D25CDR is a commercial-grade device, and its reliability and performance may not meet the requirements of high-reliability or automotive applications. Texas Instruments offers other devices that are specifically designed for these applications, such as the TPS789xx series, which are AEC-Q100 qualified and meet the requirements of high-reliability and automotive applications.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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