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LFCG-800+ - Mini-Circuits

Description: Signal Conditioning LOW PASS FLTR / SURF MT / RoHS

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LFCG-800+ - Mini-Circuits PCB footprint - Other - Other - GE0805C-2_2
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LFCG-800+ - Mini-Circuits  - 3D model - Other - GE0805C-2_2
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LFCG-800+ Details

  • Manufacturer Part Number:

    LFCG-800+

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    EIA STD PACKAGE SIZE 0805, LTCC PACKAGE

  • ECCN Code:

    EAR99

  • Manufacturer:

    Mini-Circuits

  • YTEOL:

    7

  • Center or Cutoff Frequency (fo/fc):

    400 MHz

  • Filter Type:

    CERAMIC LPF

  • Input/Output Impedance:

    50 OHM

  • Mounting Type:

    SURFACE MOUNT

  • Number of Sections-Max:

    1

  • Number of Sections-Min:

    1

LFCG-800+ Frequently Asked Questions (FAQs)

  • Mini-Circuits recommends a 4-layer PCB with a solid ground plane on the bottom layer, and a via-stitched ground plane on the top layer. The device should be placed near the edge of the board to minimize signal reflections. A low-impedance path to ground is essential for the device's internal biasing network.
  • The LFCG-800+ requires a 5V supply voltage and a bias current of 50mA. Ensure that the power supply is clean and well-regulated, and that the bias current is set correctly using the recommended resistor values. A bias tee or a dedicated bias circuit is recommended to prevent noise and signal degradation.
  • The LFCG-800+ can handle input powers up to +15dBm without damage. However, it's recommended to operate the device at input powers below +10dBm to ensure optimal performance and prevent compression.
  • Common issues can be troubleshooted by checking the PCB layout and grounding scheme, ensuring proper biasing and power supply, and verifying that the input signal is within the recommended frequency range and power level. Additionally, checking for any signs of overheating or physical damage to the device can help identify the root cause of the issue.
  • Yes, the LFCG-800+ has a maximum junction temperature of 150°C. Ensure that the device is mounted on a heat sink or a thermally conductive PCB material, and that there is adequate airflow around the device to prevent overheating. A thermal interface material (TIM) can be used to improve heat transfer between the device and the heat sink.

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LFCG-800+ Overview

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About Mini-Circuits

Mini-Circuits is a global leader in the design, manufacturing, and distribution of RF and microwave components and systems. The company's product portfolio includes a vast array of components such as amplifiers, mixers, splitters, couplers, filters, switches, and attenuators, among others. These components cover frequency ranges from DC to 65 GHz and beyond, serving applications in wireless communication, satellite communication, radar systems, test and measurement equipment, medical devices, and more.

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